Question Added thermal paste to CPU and NorthBridge, things got hotter. Should I worry?

pnvr8e

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Jan 24, 2021
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Cleaned up the CPU and added new thermal paste, did the same for the Northbridge as it was under the fan and the assembly was made of metal. The foam over the NB was already compressed and because I still had lots of thermal paste, the foam was replaced with paste. All screws were tightened then untightened slightly.

I was expecting the GPU to be cooler but it seems to be hotter to the touch. The air coming out of the exhaust is hotter as well. This might just be because the fan and cooling assembly are now getting heat from the GPU and NB as oppose to just the NB before.

The panel cover over this section has slits but they are not over the RAM, not over the CPU. That's why I run this machine 'open' when it is used over a flat surface.

With what I've done, I understand that there's going to be more heat absorbed by the fan and cooling assembly. Would this be OK or should I have replaced the foam under the NB with foam again and not with thermal paste?

How I wish the GPU was also under that cooling assembly so that I could also put paste there.
 
Just because you can replace an area with thermal paste, isn't always a good idea. Did you have thermal tape/pads prior to them being replaced with thermal paste? If so, can you relocate where they were and what their thickness was? Often times pads are used when the gap between the heatsink assembly and the heatware(chip) are too great for a thermal paste to cover(and transmit heat across).

The image above looks like a before, what is it now? I say this because you speak of foam being there one moment and the next it's removed.

What TIM did you use and what is the make and model of your laptop?
 
Just because you can replace an area with thermal paste, isn't always a good idea. Did you have thermal tape/pads prior to them being replaced with thermal paste? If so, can you relocate where they were and what their thickness was? Often times pads are used when the gap between the heatsink assembly and the heatware(chip) are too great for a thermal paste to cover(and transmit heat across).
- There was a thermal pad prior to the paste. The pads you see there are not what I replaced, they are still there. There is a white area near under the fan, that's paste and below that is the NB. I don't have an idea about the thickness, they seem to have been compressed and are already old.

The image above looks like a before, what is it now? I say this because you speak of foam being there one moment and the next it's removed.
- that's an after image.

What TIM did you use and what is the make and model of your laptop?
- TIM? Thermal Interface Material? I used thermal grease hy410. Laptop is Gateway W350a. CPU is AMD x2 TL-60 and NB is ATI RS690T.