Well.. since a 9800X is almost a 7800X3D gaming wise, it don't even need to be a X3D processor. I get it that for such a powerful CPU someone will end up with a powerful GPU as well, but if it's possible by today stabdards to make a iGPu with a 7600XT like performance why not?
Probably if they were to add anything it would be to add more Ai/NPU not iGPU , and they aren't doing that initially either. Since both have better add-in options, kind of makes a good iGPU a subset of a small group of buyers for that market. 2CUs for desktop UI , especially if the add-in card is doing GPGPU/Ai workloads makes sense.
Beyond that the majority of people buying that segment likely would prefer to save a buck or two or have higher stable clocks if they had their choice.... edit and also not impact memory resources.
Btw why did they even stop with CF???
Lots of things, cost for AIBs to build both cards and boards on already expensive hardware, bandwidth limitations at the PCie side where SSDs/NVMe started ramping up fast as well as the link side as VRAM size increased. Plus it was a pain at the time to support in fragmented CF/SLi groups and subset of owners at the time just before Mantle optimizations got rolled into DX12&OGL/V which better address resource management and pipline dependant micro-stuttering & lag.
Ironically, we now have interfaces that are fast enough, and VRAM that is large/cheap enough ( plus toward the end you could finally combine memory not just duplicate VRAM resources ) to benefit some of the physical weaknesses.
It's realistically too late for most , but could come back if multi GPUs for graphics+Ai create multi-card interest similar to that of the PhysX generation that came right before Xfire/SLi. If game Ai can be improved dramatically by adding in a GTX 4070 / RX7700, then you might see some demand especially since DX12/V mulit-GPU support is specifically optimized for heterogeneous GPU configurations.
Likely it becomes of interest/discussed again when the new chiplet solution comes out as UT mentioned above.
Although, I doubt it will use Xfire so much as use package interconnect speed & memory access plus front end management to make the dies look transparently monolithic when necessary (and also separate when desired from what's in the patent).