News AMD Confirms 5nm Ryzen 7000 Launch This Quarter, High-End RDNA 3 Launch This Year

JamesJones44

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AMD's fiscal 3rd quarter started June 25th and runs through September 24th. It could technically launch this quarter and in fall if they launch on the 22nd, 23rd or 24th of September.

My guess is the soft "launch" on the 15th with limited quantities, while general availability lands in fall. Which is a practice I hate, but companies do it with increasing frequency these days.
 
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Co BIY

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The heat spreader on that thing! No RGB for me, but raw formed metal ...

Intel's marketers need to know they are behind too.
 
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thisisaname

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<slow hand clap>

Now gives us a date for release not some vague words.
AMD's fiscal 3rd quarter started June 25th and runs through September 24th. It could technically launch this quarter and in fall if they launch on the 22nd, 23rd or 24th of September.

My guess is the soft "launch" on the 15th with limited quantities, while general availability lands in fall. Which is a practice I hate, but companies do it with increasing frequency these days.
If it only at most 6 weeks away they should give a date.
 

watzupken

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Great to see AMD keep up the heat on Intel and Nvidia. But I would prefer to see actual products and not announced now, and only see it in retail 2 or more months later. Like Rembrandt and products in the past including the infamous RDNA2 release, the products actually only turned up in reasonable volume many months later.
 
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Looks like a terrible design from a practical standpoint. How do you keep thermal past from squishing into the cutouts? Certainly can't use liquid metal on that.
You can cover them with an easy to remove tape and then apply whatever you want in big quantities, or just get better at applying thermal paste/grease/metal, lol.

I've been doing it for over 15 years and I don't have issues with overflow, to be honest. And the little that does, it always concentrates right at the top without dripping or going outside the IHS, so I think you're being overdramatic.

I know many YT'ers say "squeeze as much as you want", but the people that cares about how to apply the paste (and doesn't have a bazillion liters/gallons of it) actually are careful with the application. There's a good article here in Toms from a few years back on paste that I like, because it applies reason and "common sense" to it.

I'll try to find it and put it here.

All of that being said though, I do agree it'll apply just an extra level of complexity for builders. Is it relevant enough? I don't believe so.

EDIT: The articles!
https://www.tomshardware.com/reviews/thermal-paste-heat-sink-heat-spreader,3600.html

Regards.
 
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(Sidebar regard TIM)
I always shake my head when I see videos of people pulling the CPU/GPU heatsink off after applying TIM to 'see how it spread' and then just putting it back on. NEVER do this! Once you paste (very thin layer buttered toast method) and apply the heatsink you're done.
 
AMD is being methodical in working their road map. Please stop whining.

Dr Su and her team is bringing the 3rd Gen Infinity Arch to the forefront. It will establish THE new bar as it ramps unified memory spaces with coherent heterogeneous tiles/chiplets. Best of luck to them and their partners with TSMC.

They likely have had a good deal of advice with their own '3D Fabric' exploits.

Great to see AMD keep up the heat on Intel and Nvidia. But I would prefer to see actual products and not announced now, and only see it in retail 2 or more months later. Like Rembrandt and products in the past including the infamous RDNA2 release, the products actually only turned up in reasonable volume many months later.
 

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