You mean ryzen 4400g... Because 3400G is old Zen+ technology aka monolith architecture. Or do you mean that you want to get both cpu and gpu in one die. Then the 3400g is way to go! Zen2 Apus comes (maybe) next year.Big thanks! That seems much more energy- & latency- efficient.
One reason I want an APU is to have only one CCX. I'm trying to get a Ryzen 5 Pro 3400G.
Right now, I want a Ryzen 5 Pro 3400G. They were just announced. Pro version, because it's for a small file server and I want ECC memory, which the non-Pro APUs don't support.You mean ryzen 4400g... Because 3400G is old Zen+ technology aka monolith architecture.
As it's replacing a Phenom II, Zen+ will be a fine upgrade.Zen2 Apus comes (maybe) next year.
Yeah! In your cace it definily is a good choise!Right now, I want a Ryzen 5 Pro 3400G. They were just announced. Pro version, because it's for a small file server and I want ECC memory, which the non-Pro APUs don't support.
As it's replacing a Phenom II, Zen+ will be a fine upgrade.
It'll be interesting to see what EUV does, for TSMC's 7 nm."The largely unchanged specifications, at least in key areas, implies Milan is merely a "Tock"-equivalent, or just a move to the second-gen of the 7nm node (7nm+)."
Really? I kinda thought the whole tick-tock thing started with Sandybridge. Ivy Bridge was mostly just a node-shrink. So, then ticks should be the bigger architectural changes.You mean "tick": Intel's tock involved a significant microarchitectural change.
There is a connection between the CCXs but no on-die. The connection is through the IO die. The reason for this is because the hardware block that used to connect the two CCXs, which is called "SDF plane," was moved to the IO die. The SDF plane is part of the infinity fabric, hence the infinity symbol in the graphic you posted.There is an infinity fabric connection between the two CCX within a single die/chiplet. Much like you see in the graphic in the link below.