News AMD is reportedly set to use glass substrates for CPUs between 2025 and 2026

[Admin]

It looks like glass substrates are closer than one may think, as both Intel and AMD are expected to adopt them sooner rather than later.

AMD is reportedly set to use glass substrates for CPUs between 2025 and 2026 : Read more

 

[usertests]

AMD, not TSMC?

 

[rluker5]

Are they buying them from Intel?

 

[hotaru251]

I do wonder how the longevity of these are.

are they normal glass? tempered? if no tempered can a single fall break one?
& if tempered...are they at risk of randomly shattering like sidepanels?

 

[jkhoward]

Would be nice if you included how glass is better than organic…

 

[LabRat 891]

Would be nice if you included how glass is better than organic…

Mostly PR-wank, yes. But, one lil tidbit that makes sense.

Another reason to adopt a glass substrate is that it can enable dense interconnects without an interposer, which might lower the pricing of SiPs with many chiplets as interposers tend to be expensive.

Sounds like the interposer can be integrated-in-function to the substrate.

 

[sweepyjoelschl]

I hope they have thought about possibilities of sonic attacks on a datacenter when this tecnology is deployed. Could a sonic attack shatter the glass substrates and take out an entire datacenter?

 

[MrChippy]

Corning currently supplies two glass substrate products that go into chip production, a temporary carrier for interposer in processors and one used in wafer thinning in DRAM chips.


In the future, the glassmaker is preparing to introduce glass cores for application of the glass product in chip packaging. The company is providing samples to multiple potential customers, as reported in the Korean Herald by Corning's Korean President Mr. Vaughn Hall.

The glass substrate for wafer thinning in DRAM chips would be used multiple times before it is completely exhausted. But the envisioned glass core substrate would stay with the entire chipset, Hall explained.

"An entire packaged chip would have a single piece of glass, and this means more pieces of glass go into the chipset," Hall said, hinting at the potential growth of the demand in the future.