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It seems too good to be true for a die shrink. I can see double the cores doubling performance but halving the energy use while increasing cores? Seems too good to be true.[/quotemsg]
"Half the energy per operation" (not per chip). The way I read it is "at the same frequency, now you can fully load twice as many cores as before at the same power ", or "double the number of instructions the core is capable of computing at the same power". The end result is probably a chip with double the cores AND increased processing performance per core to some extent at power per core lower to some extent, where you can in total compute twice as much per Watt, even if the complete chip would use more power than a last-gen chip with half as many cores.
The 14nm->7nm die shrink can do that, with the architecture and IPC improvements filling the gaps of the wider architecture.
Or at least that's what they just claimed, and if their claims are even remotely close to being true, that's probably the most exciting thing in the semiconductor industry since the Core architecture debuted in 2006, if not bigger.
What I also understood to be confirmed, is that we will have 8 cores per CCX. That's prospects of 8-core mainstream chips with no interconnect. That would mean we would have separate dies for <8-core chips from the get-go, and interconnect used only on Threadripper-class chips, and that would be really darn perfect.