News AMD Zen 4 'Raphael' CPU Renders Show Fascinating Design

I would be really surprised if the actual package had all of those cut-outs in it, that would be quite a bit of extra seemingly unnecessary machining. Semiconductors are also photo-sensitive, which would make cut-outs exposing the dies at some angles potentially problematic in cases overflowing with RGB.

I could imagine the extra package height being necessary to accommodate a wider range of under-IHS component heights.
 
Seems as likely to be accurate as suggesting the Zen 4 heat spreader would be fixed with baked beans. Yet another pointless article, based on unsubstantiated rumours, on a Future Publishing website.