You don't need an ambient temperature sensor for that: the VRM tells you the board power being pumped into the HSF, the HSF engineers should have characterized the HSF's thermal resistance as a function of fan speed, so you can already derive ambient temperature from characterized junction-heatsink-air thermal resistance as a function of fan speed, junction temperature and board power.
I suppose stuffing a sensor in there is the lazy work-around for not characterizing the HSF beyond making sure it can cope with max load under worst-case supported conditions.