I recently set up the successful newegg promotion featuring the Biostar mobo TForce 550 / AMD x2 Brisbane 3600+. Cpu freq out of the box is 1900 mhz, and Ive fairly easily overclocked it to 2810 mhz. Ive run it for 40 hrs this way without a single glitch, including a 2 hr Orthos session (2 core simultaneous 100% load via primes on each core). Im still planning on doing an 8 hr Orthos session, but I wanted to get this temperature thing ironed out first.
The cpu I bought was an OEM version, and before I learned enough about heatsinks, I bought and installed a MassCool 5F531B1M3CG, which is approved to anything up to the x2 4800+. Actually, I dont think its a terrible unit judging by my results, but I want to hear from you guys!
Heres the result its produces.. With a case temperature of 28 degrees C, my idle CPU temp, as measured by Speedfan and confirmed by Biostar's temp utility and Pc Wizard is also 28 degrees! If the case temp goes to 30, so does the cpu idle temp. It always follows the case temp very nicely, which is about all I could hope for on Air. (Ive learned alot about what to expect from cooling efforts through my experience with my car's supercharger and Intercooler!).
Results:
CPU Speed: ------- Stock(1900mhz) - 2375mhz - 2616mhz - 2809mhz
case temp---------- 29--------------------27-----------27----------27
idle temps-----------29--------------------26-----------26----------26
100% load tmps----42--------------------42-----------45----------47 to 50
Im pretty sure these temps are accurate as theyve been confirmed by three utilities.. The one temp reading I do NOT use is the Speedfan Core temperature because its always reported at between 15 degrees and 17 degrees C, and I know thats not right, and clearly the board is taking a value from the core that has changed and is not being interpreted correctly.. The other values I trust, however. They are reasonable wrt case temps and Ambient, and the way the cpu temp at idle follows closely the case temp, plus the 3 utilities confirmations confirms that this is an accurate reading as Im going to get. Given that, staying at or under 50 degrees with the highest stressor (orthos in each core) at its current overclocked 2.8ghz configuration leads me to think I am ok, and do not need further cooling. The low idle temps are also pleasing.
The one thing I really wanted to ask you is about Lapping.. There were alot of machine marks on the HSF surface, and I was thinking I might be able to lower my temps perhaps 3 degrees at hi load, perhaps more, by both Lapping the surface, AnD replacing the white thermal grease I used that came with the HSF with some Arctic Silver 5 which I have.
So, do you think Im ok leaving things as they are? Or, would you encourage me to Lap and use the AS5 Ive got? The reason Im asking is that sometimes, with other projects, by trying to be 'too fine', Ive managed to screw something up. So after several experiences with that, I kind of adopted a 'leave well enough alone' philosophy. Still, what Im talking about is simple enough, so long as I dont bend a clip on the hsf, or bust a prong when attempting its removal!
What do you think? And thanks!!
The cpu I bought was an OEM version, and before I learned enough about heatsinks, I bought and installed a MassCool 5F531B1M3CG, which is approved to anything up to the x2 4800+. Actually, I dont think its a terrible unit judging by my results, but I want to hear from you guys!
Heres the result its produces.. With a case temperature of 28 degrees C, my idle CPU temp, as measured by Speedfan and confirmed by Biostar's temp utility and Pc Wizard is also 28 degrees! If the case temp goes to 30, so does the cpu idle temp. It always follows the case temp very nicely, which is about all I could hope for on Air. (Ive learned alot about what to expect from cooling efforts through my experience with my car's supercharger and Intercooler!).
Results:
CPU Speed: ------- Stock(1900mhz) - 2375mhz - 2616mhz - 2809mhz
case temp---------- 29--------------------27-----------27----------27
idle temps-----------29--------------------26-----------26----------26
100% load tmps----42--------------------42-----------45----------47 to 50
Im pretty sure these temps are accurate as theyve been confirmed by three utilities.. The one temp reading I do NOT use is the Speedfan Core temperature because its always reported at between 15 degrees and 17 degrees C, and I know thats not right, and clearly the board is taking a value from the core that has changed and is not being interpreted correctly.. The other values I trust, however. They are reasonable wrt case temps and Ambient, and the way the cpu temp at idle follows closely the case temp, plus the 3 utilities confirmations confirms that this is an accurate reading as Im going to get. Given that, staying at or under 50 degrees with the highest stressor (orthos in each core) at its current overclocked 2.8ghz configuration leads me to think I am ok, and do not need further cooling. The low idle temps are also pleasing.
The one thing I really wanted to ask you is about Lapping.. There were alot of machine marks on the HSF surface, and I was thinking I might be able to lower my temps perhaps 3 degrees at hi load, perhaps more, by both Lapping the surface, AnD replacing the white thermal grease I used that came with the HSF with some Arctic Silver 5 which I have.
So, do you think Im ok leaving things as they are? Or, would you encourage me to Lap and use the AS5 Ive got? The reason Im asking is that sometimes, with other projects, by trying to be 'too fine', Ive managed to screw something up. So after several experiences with that, I kind of adopted a 'leave well enough alone' philosophy. Still, what Im talking about is simple enough, so long as I dont bend a clip on the hsf, or bust a prong when attempting its removal!
What do you think? And thanks!!
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