TBF if it is using the RL ILM in the first place and the bending was akin to the pre 12th gen level I think keeping the stock RL ILM is a better choice as even AIO now are more or less convex to compensate for it as well as the like of Noctua cooler.
The 1700 one became a problem firstly as it is so hot to boot, then the bending even bends the PCB after like 6-12 months as some online users showed, which the CPU still works, just to some extend might affect the long term stability or with cooling performance decreased, plus it made more budget motherboards bendy too.
Now as ARL have the heat center shifted, keeping it dead flat with a convex cooler base might not be a cool idea to boot, and that ARL is finally being reasonable in heat and power draw, it may not worth the hassel to use a contact frame this gen. Of course, for the non RL style ILM, the force needed to lock it from the 12700KF era is like much larger than what I am personally comfortable to use in a CPU, if new board come with that and the thermalright fool proof frame is available at $10 as it is, I will keep going with that with ARL.
All these are pure discussion as myself and those around will definitely skip intel for near future, just see how it goes, at this point of time it looks just like in the "delidding class" to ARL, which is only for extreme overclockers but not for real cooling/anti-(severe)bending for normal users