News ASE developing square packaging substrate tech to replace round wafers

[Admin]

ASE to explore panel level packaging ahead of possible switching to glass substrates.

ASE developing square packaging substrate tech to replace round wafers : Read more

 

[Captnimo]

This is easier said than done. Most of the Si semiconductor industry had a hell of a time just getting to 300mm, with most of the SiC still struggling to get to 200mm. There’s 450mm, but that’s seen as an Okapi, so rare people don’t even think it exists. Bowing and flatness issues aside, having to respec an entire industry from front to back end would cost hundreds of billions, possibly trillions of dollars - you couldn’t just repurpose old 300mm equipment, since the stage is roughly ~600mm by 600mm; you’d have to build a whole new system for grinders, dicers, probers, lithography, and inspection. Now, not saying it couldn’t be done, however such a leap isn’t going to be easy.