News ASML and TSMC Reveal More Details About 3nm Process Technology

[Admin]

TSMC's N3 fabrication process to use EUV for over layers.

ASML and TSMC Reveal More Details About 3nm Process Technology : Read more

 

[jkflipflop98]

Those tools are expensive in both money and time. They're incredibly complex and MASSIVE. You have to reinforce your fab flooring to hold the weight of one. You also have to install a cleanroom-approved gantry crane system in the ceiling for moving the chunks of the tool around during maintenance. It's crazy to see.

 

[LBby]

Hi,
can you post a link to some documentary showing that ?
thx

 

[jasonkaler]

"it enables its customers to use EUV for up to over 20 layers "
So more or less 20? Give or take.

 

[drivinfast247]

"it enables its customers to use EUV for up to over 20 layers "
So more or less 20? Give or take.

Possibly. Within reason.

 

[gabriel95]

Hi,
can you post a link to some documentary showing that ?
thx

EUV: Lasers, plasma, and the sci-fi tech that will make chips faster | Upscaled

 

[jasonelmore]

Intel also has several of these new EUV lithography scanners from ASML but can't even do 7nm. I think it says a lot about the quality of their engineering team.