News ASML delivers 3rd generation EUV chipmaking tool for 2nm and beyond

[Admin]

ASML's Twinscan NXE:3800E speeds up wafer processing to up to 220 wafers per hour and can enable 2nm and thinner process nodes.

ASML delivers 3rd generation EUV chipmaking tool for 2nm and beyond : Read more

 

[DavidLejdar]

Nice! I have no clue, which company will make the most use of it. But among ETF savings plan running, I have one for semiconductors in general, sort of providing capital for the investments needed. And once I have a bit on the side, as a rainy day fund to be able to buy e.g. a new pair of shoes or a fridge (in pension, or earlier if for some reason unemployed), in a about a year or two, I might upgrade my HW with something from the Twinscan NXE:3800E.

Still waiting for some better innovations, which make use of improved technology though. Like, improved processors will likely show in improved versions of smartphones, tablets and laptops (and standalone AR/VR). But there is also the option to use e.g. a tablet to remote connect to own rig at home (over the internet). And in that context, it would be nice if there were some hand-held devices, which save a bit of money on the processing power, but have a top screen. That might not be a large market in regard to customers with a rig. But with improved internet connections, i.e. video game streaming may see some growth - and such a device could arguably help to keep the entry cost low (while also providing some workload for the upgraded data centers).

 

[sjkpublic]

Ditto. Nice! Good thing they are not based in Taiwan. 2nm is the future.

 

[P.Amini]

Ditto. Nice! Good thing they are not based in Taiwan. 2nm is the future.

Good thing is TSMC is already using ASML as its tool and will buy this tool too!