>So, what you are saying is that all parts of the wafer are
>equal
No, that is not what I said. Where did you read that ?
Its indeed true that in general, dies from the center of the wafer will be better and/or yield and/or binsplit better. I just don't believe that opterons come from the center and semprons from the edge. In fact, I recall reading entire wafers are predestined to be opterons, as they run on different production lines. So the "center ones" (or rather: the best ones) may end up as HE opterons, or 2.6 GHz parts or whatever, where most of the edge ones might only pass qualification for a full voltage, or lower clocked opterons.
AMD might or might not recover some dies that could not be used as Opterons (because of too many cache defects, non functional HT links or other reasons) as semprons, but even *if* they do that, it will be a very rare occurance. Its simply not true that AMD (or intel) produces a lot of generic dies, and then reserves only the best ones to become server parts, and packages the rest as desktop parts. If there is a difference, its only tighter qualification (lower tolerances) of the server parts.
>Having been the beneficiary of that binning, when using an
>xp-m chip, I dissagree.
That is totally unrelated. Obviously, mobile parts are binned and validated because of exceptional abilities to run at lower Vcore, and or lower power consumption, so these parts are pretty much guaranteed to have a great overclocking potential. But what you bought as a XP-M 2500+ @1.2v (just guessing, numbers don't matter), might just as well have been sold as a desktop XP 3200+ @1.5v for instance. Although even here, I'm wouldn't be surprised if mobile parts come from different production lines, with a process skewed for lower clock binning, but better power characteristics. Just that maybe some of the worse parts of this line could still end up as cheap desktop chips, if they can neither clock high, nor run at low voltages.
But that is for mobile chips, which indeed need to have different characteristics than desktop or server parts. But I don't really see different requirements between (full power) Opteron 1xx, 2xx and 8xx or even A64s, HT links aside.
>While the opteron chips might only be .0001% less likely to
>run into an error, than an A64 chip, that would be >significant advantage.
Fair enough. But the best chances to obtain that 0.001% increase is clock the part lower. Its indeed plausible that on average A64s run slightly closer to their tested limits than Opterons. But the difference will not be bigger than on average half a speed grade or so, and if you look at the pricing, you'll notice a 2.4 GHz opteron 850 doesn't cost anywhere near the same as 2.2/1Mb A64. So binning doesn't explain the price differential, the main reason is opportunistic pricing, and to a lesser degree, the worse economy of scale for the different testing, packaging, marketing, etc of the low volume server parts.
In short, there is basically no real difference (HT links aside again) on the die level between an Opteron 1xx and 8xx, or any opteron and an A64 running, say, 100 or so MHz slower.
>As i said before, the 8 way opterons are the best of the
>best.
I would suspect the Opteron EE versions are the "best of the best", regardless wether they are 1xx, 2xx or 8xx ones, because the EE's *are* binned differently. But they are likely not any better or different than 100 Mhz higher clocked Turions with all HT links enabled .
= The views stated herein are my personal views, and not necessarily the views of my wife. =