I got couple of problems with what you said
1. several lead free solder alloys have better thermal fatigue properties than eutectic tin-lead.
2. typically components can withstand temps up to 250-260c, ceramic caps even higher.
3. most lead free solders arent exactly eutectic so they dont have exact melting point, rather a window where the solder is more or less partially molten, and you should go like 5-10c above that window (at least) on the coldest joint on the board to get proper joints (without cooking the components on the hottest point). 217-222 is typical temperature window a solder melts in, so 228c would be a good point to aim at.
and the machines we use at work cost way more than the hobby kit you have
😛
anyways it wasnt really smart to place the board 'face down' like the op did, when the solder melts there isn't much keeping the heavier components in place anymore, there is a limit what the surface tension can hold up...