HWOC,
On behalf of Tom's Moderator Team, welcome aboard!
Delidding requires that you use
only liquid metal TIM between the Die and IHS. Paste (pTIM) will gradually but rapidly fail in as little as a few weeks to a few months, while Core temperatures steadily increase, requiring periodic deliddings and reapplications.
Due to thermal cycling, a process known as “pump-out” will expel pTIM from between the Die and IHS, whereas liquid metal is very resistant to pump-out and will last several years, far outpacing any pTIM products. While Intel's pTIM is formulated to resist pump-out, it still degrades over time, losing its thermal bond with the Die.
The most recommended liquid metal TIM is
Thermal Grizzly Conductonaut. For comparison, here’s a short list of TIM in order of thermal conductivity:
Indium - 81.8 W/mk (Used in processors with sTIM "soldered" IHS)
Liquid Metal TIM (Die to IHS)
Thermal Grizzly Conductonaut - 73.0 W/mk
CoolLaboratory Liquid Extreme - 41.0 W/mk
CoolLaboratory Liquid Ultra - 38.4 W/mk
CoolLaboratory Liquid Pro - 32.6 W/mk
Paste TIM (Cooler to IHS)
Thermal Grizzly Kryonaut - 12.5 W/mk
Arctic Silver 5 - 9.0 W/mk
Arctic Cooling MX4 - 8.5 W/mk
Gelid Solutions GC-Extreme - 8.5 W/mk
It's disappointing to note that Noctua does not provide thermal conductivity specifications for NT-H1 or NT-H2.
When relidding, use
extreme care as you place the IHS onto the Die. Any lateral movements will smear the liquid metal, which will compromise thermal results. Moreover, as you move the CPU retention lever into the latched position, the retention frame moves with it. If the IHS is not sealed, the frame movement can cause the IHS to move, smearing the liquid metal and compromising an otherwise perfect delidding job. Therefore, always use a sealant, patience and attention to detail, allowing ample time for the sealant to completely cure.
Once again, welcome aboard!
CT
