So far I've only accumulated surface data on Artic range i,e. Silver5, Ceramique, Alumina and MX-1. All vary in performance depending on surface finish.
That must be a rather time-intensive study you're doing, Wusy. Testing not onloy the different thermal compounds, but gathering comparison data on how they perform with different contact surfaces. Perhaps you should publish?
Someplace, I recall seeing a poster recommending that one use AS5 between a GPU and waterblock, but stating that Ceramique was better for the RAM-chips in the same installation (Danger Den-type full-coverage waterblock). Struck me as odd, at the time, but if, as you're saying, different compunds work better with different contact surfaces (which does make a certain sense) then the issue seems much clearer. One would want to choose an array of thermal compounds to maximize the effect of each cooling instalation. Or, as seems most common, one would choose a superior compound for the critical interface (like a processor) and use it elsewhere as a 'good enough' solution.
I also read the article in Maximum PC, and the bottom line was... use any thermal grease or paste, since the temp diff is usually so minimal it doesn't matter. Personally, I stand by AS5, though it seems 50/50 between AS5 and AS Ceramique users...
I didn't mean to question MrsD's assertion (or yours), simply that I didn't find the article online. So many PC mags, so little time. I generally only do a search on topics that I'm currently curious about and have 2-3 'general' PC news sites and forums that I watch for mention of interesting topics.
It seems clear that
some sort of thermal interface compound is better than none at all.
Be Well!
Fireheart