- Jan 8, 2022
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Fun new cooling things, do you like any of them?
Water propellers with bumps on them called tubercles are 30% more efficient, at a one person business the person could 3D print tubercles efficient fans for pc users, if they like they can get a free copyright on the tubercles 3D shape. Up to 30% more airflow from a new fan.
Single soda can fridges or makeup fridges are $11 at alibaba, drill an inlet and outlet hole in one of these and hose connect or place right next to intake fan, because it is continuous the most cooling hoped for is 1-5°C, cooler intake air,
A refrigerator compressor motor is just $3 on alibaba. If a motherboard and ram were placed in a 3D printable or injection moldable polymer container, and the compressor made 11-24 atmospheres of pressure, then fans internal at the compressed air could move 11-24 times as many atoms per rotation and cool 11-24 times more. One side of the pressure container could be all heatsink, either fins, prongs, or pump through tubes, keeping the compressed air interior cool. As a parts cost this is comparable to a pressure compatible disposable propane cylinder, or 7 cast acrylic 35¢ alibaba. Com llghters as a small cheaply mass produced container for just the CPU chip and Ram.
Doing compressed air on your own pc: As a startlingly kludgey retrofit to a motherboard you could just place a big bead of silicone sealant around the cpu and under a right diameter 3cm tall 3D printed connector pipe with a fitting for the compressor pump output. The 3D printed connector pipe could be made out of metal or the most warmth conductive plastic and have gas channels in it that looped around each other, did countercurrent flow, carried water, or were also piezoelectric ally vibrated. At a production version the compressor motor that replaces the refrigerator compressor could be 1/100th the size and energy usage such as alibaba 9-35¢ bulk minimotors, that's because after you have compressed the gas, you only need to top it up a little ocassionally. Also if someone wanted to engineer a completely new thing like a soundless metal flexing piezo buzzer connected to a no moving parts thing called a tesla valve then a 1/2 cc/minute 24-48 atmospheres of pressure could be produced at 2¢ each
Make a metal heat sink but the fins or prongs are like tuning Y resonators, visibly or invisibly vibrating when an aimed 3¢ piezoelectric vibrato or dollar store headphone is aimed at them, this causes 100-1000 times more air molecule contacts per second from vibration thus much greater cooling. The tuning Y pillars on the heat sink and their resonating stimulant frequency could be above the range of human and companion animal hearing. An even cheaper alternative is to use a 12,000 rpm 35¢ alibaba motor with a thunking mass on the shaft to vibrate a multipronged CPU heat sink, doubling voltage to the motor doubles audio frequency to 24KHz, above human hearing, and the thunker mass on the shaft, which is lopsided, could have multiple bumps, or perhaps bell tuning to it to produce higher energy thumps, or three mini-thumps per rotation to make 36KHz stimulation of the heat sink fins or prongs. Noting they are now vibrating and possibly moving in a 1-2 mm visible blur, the heat sink fins or prongs benefit from having transverse holes cast or laser drilled in them, giving both active air swishing, and much higher surface area. The do it yourself hobby version is just to glue a high dynamic range headphone core to a heatsink, then play sounds in 20 hz steps, physically looking at the thing to notice when it goes blurry from motion like a Y tuning shape, then running a cpu temperature diagnostic to find out if a moving and physically blurry heat sink actually does cool better and how much. As a one person business a person could simply glue headphone cores, or even Bluetooth headphone cores to the 11 most popular heatsink on Amazon, and publish videos showing the 20-40° improvement. At crypto currency miners plural headphone heatsink would perhaps double or quadruple crypto currency miner lifetime at highest overclock ING voltage, this increases the total lifetime money earned by the crypto currency miner before it ceases working.
One thing chip makers could do to remove 10-20% of the heat from their chips is, after the circuitry photo lithography is complete deposit a layer of siO2 quartz or an ultrathin gold or geas ir lensing grating that focuses the radiant ir component of the chips heat into the metal of the package cap, as a nifty thing I read that metal becomes slightly transparent with a grating etched on it, so metal chip caps could have those gratings cheaply embossed or lasered onto them so they grab radiant ir for reradiation to the package exterior. Depending on value, both sides of the chip, including the base nonfeature size could have ir fresnel lensing features that focalize the ir out of the chip compartment.
Also, I think the chip companies could do more when it comes to making chip packaging more thermally transmissive. Using lasers or sparsely granular wide aperture sintered plastics every chip package could have long branched micrometer tunnels through the plastic, these tunnels would connect, and chip heat would spread, making the chip cooler and extra easy to externally spread. The other thing they could do with chip packaging plastics ceramics and metals is say, let's fill an aerogel with no conductive heat sink grease, then put a 11% surface lattice of an engineering polymer on it for structural strength.
s a radiant
Water propellers with bumps on them called tubercles are 30% more efficient, at a one person business the person could 3D print tubercles efficient fans for pc users, if they like they can get a free copyright on the tubercles 3D shape. Up to 30% more airflow from a new fan.
Single soda can fridges or makeup fridges are $11 at alibaba, drill an inlet and outlet hole in one of these and hose connect or place right next to intake fan, because it is continuous the most cooling hoped for is 1-5°C, cooler intake air,
A refrigerator compressor motor is just $3 on alibaba. If a motherboard and ram were placed in a 3D printable or injection moldable polymer container, and the compressor made 11-24 atmospheres of pressure, then fans internal at the compressed air could move 11-24 times as many atoms per rotation and cool 11-24 times more. One side of the pressure container could be all heatsink, either fins, prongs, or pump through tubes, keeping the compressed air interior cool. As a parts cost this is comparable to a pressure compatible disposable propane cylinder, or 7 cast acrylic 35¢ alibaba. Com llghters as a small cheaply mass produced container for just the CPU chip and Ram.
Doing compressed air on your own pc: As a startlingly kludgey retrofit to a motherboard you could just place a big bead of silicone sealant around the cpu and under a right diameter 3cm tall 3D printed connector pipe with a fitting for the compressor pump output. The 3D printed connector pipe could be made out of metal or the most warmth conductive plastic and have gas channels in it that looped around each other, did countercurrent flow, carried water, or were also piezoelectric ally vibrated. At a production version the compressor motor that replaces the refrigerator compressor could be 1/100th the size and energy usage such as alibaba 9-35¢ bulk minimotors, that's because after you have compressed the gas, you only need to top it up a little ocassionally. Also if someone wanted to engineer a completely new thing like a soundless metal flexing piezo buzzer connected to a no moving parts thing called a tesla valve then a 1/2 cc/minute 24-48 atmospheres of pressure could be produced at 2¢ each
Make a metal heat sink but the fins or prongs are like tuning Y resonators, visibly or invisibly vibrating when an aimed 3¢ piezoelectric vibrato or dollar store headphone is aimed at them, this causes 100-1000 times more air molecule contacts per second from vibration thus much greater cooling. The tuning Y pillars on the heat sink and their resonating stimulant frequency could be above the range of human and companion animal hearing. An even cheaper alternative is to use a 12,000 rpm 35¢ alibaba motor with a thunking mass on the shaft to vibrate a multipronged CPU heat sink, doubling voltage to the motor doubles audio frequency to 24KHz, above human hearing, and the thunker mass on the shaft, which is lopsided, could have multiple bumps, or perhaps bell tuning to it to produce higher energy thumps, or three mini-thumps per rotation to make 36KHz stimulation of the heat sink fins or prongs. Noting they are now vibrating and possibly moving in a 1-2 mm visible blur, the heat sink fins or prongs benefit from having transverse holes cast or laser drilled in them, giving both active air swishing, and much higher surface area. The do it yourself hobby version is just to glue a high dynamic range headphone core to a heatsink, then play sounds in 20 hz steps, physically looking at the thing to notice when it goes blurry from motion like a Y tuning shape, then running a cpu temperature diagnostic to find out if a moving and physically blurry heat sink actually does cool better and how much. As a one person business a person could simply glue headphone cores, or even Bluetooth headphone cores to the 11 most popular heatsink on Amazon, and publish videos showing the 20-40° improvement. At crypto currency miners plural headphone heatsink would perhaps double or quadruple crypto currency miner lifetime at highest overclock ING voltage, this increases the total lifetime money earned by the crypto currency miner before it ceases working.
One thing chip makers could do to remove 10-20% of the heat from their chips is, after the circuitry photo lithography is complete deposit a layer of siO2 quartz or an ultrathin gold or geas ir lensing grating that focuses the radiant ir component of the chips heat into the metal of the package cap, as a nifty thing I read that metal becomes slightly transparent with a grating etched on it, so metal chip caps could have those gratings cheaply embossed or lasered onto them so they grab radiant ir for reradiation to the package exterior. Depending on value, both sides of the chip, including the base nonfeature size could have ir fresnel lensing features that focalize the ir out of the chip compartment.
Also, I think the chip companies could do more when it comes to making chip packaging more thermally transmissive. Using lasers or sparsely granular wide aperture sintered plastics every chip package could have long branched micrometer tunnels through the plastic, these tunnels would connect, and chip heat would spread, making the chip cooler and extra easy to externally spread. The other thing they could do with chip packaging plastics ceramics and metals is say, let's fill an aerogel with no conductive heat sink grease, then put a 11% surface lattice of an engineering polymer on it for structural strength.
s a radiant
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