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SuperG

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Jul 21, 2006
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It obvious that if shader cores and TMU and Rops get much more numerous. Also Adress bus got wider. As memory speeds just don't keep up with these growing numbers. The memory bus also draw small amount of power per pin and trace and the logic at each end. But that for 512 which does add up.

The next step going to 1024 in steps. I see a routing problem of traces.
Much more layerd PCB can solve that bit. But the signal limitation get bigger which means need to get lower also latencies get bigger.

So HBM make sense.

To get a picture of this you need to know a bit about EM behavior of high frequency signals.
 
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