Very true, but as I said in my original posting, it's a risk I'd be prepared to take. Admittedly, the risk of breaking a CPU during "cold" de-lidding may be significantly higher (10%?) than the risk of static damage due to mishandling in the der8auer labs, where they employ heat to release the IHS with minimal mechanical stress.
Nonetheless, CPU, GPU, RAM and mobo manufacturers supply their products in ESD packaging for a well proven reason. Static damage can kill components. It may only happen once every 10,000 times due to sloppy or cavalier handling, but that risk is still far too high if it means a satellite stops working or a plane crashes.
The multi billion dollar companies I've worked for spend millions equipping their labs with ESD protection. They fit special floor tiles, work bench surfaces, wrist straps, gloves, coats, shoes and hair protection. I would hope that Intel and AMD take similar precautions when manufacturing CPUs. What happens to them afterwards due to naive or blatant disregard for ESD, is out of their hands.
I suspect far more CPUs die due to faulty BIOS boost voltages or manual overvolting, but a few early deaths might be attributable to ESD damage. You'll never know unless someone checks the die under an electron microscope and that's not going to happen for a standard RMA.
Some people know about ESD damage and take precautions. Other people are blissfully ignorant. A third category are aware, but think "it'll never happen to me". They're probably right 99.9999% of the time, but there's always that 0.0001% chance they'll zap an expensive CPU from a blasé approach to ESD handling.
https://www.electronicdesign.com/te...eos-and-esd-failures-in-semiconductor-devices
The choice is yours.