Certainly seems to put a different stress on the CPU than does some of the benchmarks. I can run my 3950x at 4.4 all core and run Cinebench and cpu-z stress tests without issue but doing so with Folding running a job will crash the system.
And agreed on the work units. That 10x supercomputer power spends most of the day twiddling its thumbs. Fully closing and restarting the client seems to have a greater success rate in getting WU for either the CPU and/or GPU vs. just waiting.
Yeah, II figured out the trick of restarting the client, but while I got a solid bunch of WU's a few days ago, they've dried up to the point I'm not running the client anymore. I found many workloads specify 16 core or more, cpu only, or were offered with very short expiration windows and extremely low points, although I could care less about points. I just want to help.
So it seems the troubles are too many clients and not enough WU's, the WU's authors wanting to get their results in 15 minutes vs an hour so as to be overly picky about the iron it runs on and server end overloads issuing and accepting results.
I believe the f@h client uses more of the integer and fpu math execution than your average cpu tester, that tends to be more broad spectrum.
I've also learned a lot about the 3000 series ryzens and cooling. After finding so many people with cooling issues, even with fairly large air cooling setups, and only the folks with higher end water cooling being able to fold without overheating, seems AMD's "chiplet" design changes cpu thermals. Used to be most of the heat came from the center portion of the die, while the ryzen architecture spreads that around the package.
I did a whole day of testing with different coolers. I found the ones with a larger heat sink and a square contact point larger than the die offered a good 10c improvement. Even a very tall Aidos radiator model with a huge fan and a round contact point that didn't cover the edges of the die wasn't any better than the crap cooler that HP put on the cpu. I made sure case temps weren't an issue with the side off and a big fan blowing into the system.
I then read a lot about how PBO works (precision boost, default turned on) and that it may seriously push thermals by over volting and/or overboosting to show better short term performance, but sustained use of PBO can create heat problems. As in running a 3 hour cpu fold vs a 2 minute benchmark. I found a windows power plan called '1usmus universal', made specifically to address cpu thermals while not hitting performance by much. THAT was a bigger deal, giving me a 10C drop in temps while folding.
So with a new much bigger heat sink (1.5" thick instead of .5" thick), a faster cpu fan, and that power plan installed, I went from 92-94C cpu temps down into the low 80C range. I'm okay with 80. Seems AMD is okay with 90+ but I'm not!