G.SKILL ddr4 Ripjaws V F4-3200C15Q-32GVK (4x8GB kit) info - Samsung b-die?

[xeon_fan]

Hi I would like to get information what kind of memory it is ...
G.SKILL ddr4 Ripjaws V F4-3200C15Q-32GVK (4x8GB kit) Samsung b-die?
I want to use it two separated setups (2x8GB each one) but before I would like to confirm what kind of memory it is ...
- is it Samsung or Hynix ?
- is it SS or DS (according to ASUS QVL it is SS) ?
- is it Single rank or dual rank ?
- is it (if samsung based) legendary b-die?

I cannot check by myself :/ all my current setups are dd3 :/

Thanks for the help

 

[Seanie280672]

Hi I would like to get information what kind of memory it is ...
G.SKILL ddr4 Ripjaws V F4-3200C15Q-32GVK (4x8GB kit) Samsung b-die?
I want to use it two separated setups (2x8GB each one) but before I would like to confirm what kind of memory it is ...
- is it Samsung or Hynix ?
- is it SS or DS (according to ASUS QVL it is SS) ?
- is it Single rank or dual rank ?
- is it (if samsung based) legendary b-die?

I cannot check by myself :/ all my current setups are dd3 :/

Thanks for the help

This should answer your question: https://www.reddit.com/r/Amd/comments/62vp2g/clearing_up_any_samsung_bdie_confusion_eg_on/

 

[xeon_fan]

This should answer your question: https://www.reddit.com/r/Amd/comments/62vp2g/clearing_up_any_samsung_bdie_confusion_eg_on/

Well, I been there before ... F4-3200C15Q-32GVK is not covered there :/

 

[shrapnel_indie]

This should answer your question: https://www.reddit.com/r/Amd/comments/62vp2g/clearing_up_any_samsung_bdie_confusion_eg_on/

Well, I been there before ... F4-3200C15Q-32GVK is not covered there :/

I have a set of F4-3200C15Q-32GVK in my PC at home. (I'm at work right now.) Let me see if CPU-Z will tell me when I get home.

 

[xeon_fan]

I have a set of F4-3200C15Q-32GVK in my PC at home. (I'm at work right now.) Let me see if CPU-Z will tell me when I get home.

Thank you !
If you could check it with : Thaiphoon Burner application and provide me a screenshot it would be great

Link to the application:

http://www.softnology.biz/files.html

 

[shrapnel_indie]

Using PassMark's RAMMon, My particular sticks of RAM (about a year old) use Samsung DRAM chips. Here is the data:

RAMMon v1.0 Build: 1016 built with SysInfo v1.0 Build: 1121
PassMark (R) Software
www.passmark.com

Memmory summary for <REDACTED>:
Number of Memory Devices: 4 Total Physical Memory: 32605 MB (32768 MB)
Total Available Physical Memory: 28798 MB
Memory Load: 11%

Item | Slot #1 | Slot #2 | Slot #3 | Slot #4 | Slot #5 | Slot #6 | Slot #7 | Slot #8 |
--------------------------------------------------------------------------------------|----------------------------------------|----------------------------------------|----------------------------------------|----------------------------------------|-----------------|-----------------|-----------------|-----------------|-
Ram Type | DDR4 | DDR4 | DDR4 | DDR4 | Not Populated | Not Populated | Not Populated | Not Populated |
Maximum Clock Speed (MHz) | 1600 (XMP) | 1600 (XMP) | 1600 (XMP) | 1600 (XMP) | | | | |
Maximum Transfer Speed (MHz) | DDR4-3200 | DDR4-3200 | DDR4-3200 | DDR4-3200 | | | | |
Maximum Bandwidth (MB/s) | PC4-25600 | PC4-25600 | PC4-25600 | PC4-25600 | | | | |
Memory Capacity (MB) | 8192 | 8192 | 8192 | 8192 | | | | |
Jedec Manufacture Name | G Skill Intl | G Skill Intl | G Skill Intl | G Skill Intl | | | | |
Search Amazon.com | Search! | Search! | Search! | Search! | | | | |
SPD Revision | 1.1 | 1.1 | 1.1 | 1.1 | | | | |
Registered | No | No | No | No | | | | |
ECC | No | No | No | No | | | | |
DIMM Slot # | 1 | 2 | 3 | 4 | | | | |
Manufactured | | | | | | | | |
Module Part # | F4-3200C15-8GVK | F4-3200C15-8GVK | F4-3200C15-8GVK | F4-3200C15-8GVK | | | | |
Module Revision | 0x0 | 0x0 | 0x0 | 0x0 | | | | |
Module Serial # | 0x0 | 0x0 | 0x0 | 0x0 | | | | |
Module Manufacturing Location | 0 | 0 | 0 | 0 | | | | |
# of Row Addressing Bits | 16 | 16 | 16 | 16 | | | | |
# of Column Addressing Bits | 10 | 10 | 10 | 10 | | | | |
# of Banks | 16 | 16 | 16 | 16 | | | | |
# of Ranks | 1 | 1 | 1 | 1 | | | | |
Device Width in Bits | 8 | 8 | 8 | 8 | | | | |
Bus Width in Bits | 64 | 64 | 64 | 64 | | | | |
Module Voltage | 1.2V | 1.2V | 1.2V | 1.2V | | | | |
CAS Latencies Supported | 10 11 12 13 14 15 16 | 10 11 12 13 14 15 16 | 10 11 12 13 14 15 16 | 10 11 12 13 14 15 16 | | | | |
Timings @ Max Frequency (JEDEC) | 15-15-15-36 | 15-15-15-36 | 15-15-15-36 | 15-15-15-36 | | | | |
Maximum frequency (MHz) | 1067 | 1067 | 1067 | 1067 | | | | |
Maximum Transfer Speed (MHz) | DDR4-2133 | DDR4-2133 | DDR4-2133 | DDR4-2133 | | | | |
Maximum Bandwidth (MB/s) | PC4-17000 | PC4-17000 | PC4-17000 | PC4-17000 | | | | |
Minimum Clock Cycle Time, tCK (ns) | 0.938 | 0.938 | 0.938 | 0.938 | | | | |
Minimum CAS Latency Time, tAA (ns) | 13.750 | 13.750 | 13.750 | 13.750 | | | | |
Minimum RAS to CAS Delay, tRCD (ns) | 13.750 | 13.750 | 13.750 | 13.750 | | | | |
Minimum Row Precharge Time, tRP (ns) | 13.750 | 13.750 | 13.750 | 13.750 | | | | |
Minimum Active to Precharge Time, tRAS (ns) | 33.000 | 33.000 | 33.000 | 33.000 | | | | |
Minimum Row Active to Row Active Delay, tRRD (ns) | 3.700 | 3.700 | 3.700 | 3.700 | | | | |
Minimum Auto-Refresh to Active/Auto-Refresh Time, tRC (ns) | 46.750 | 46.750 | 46.750 | 46.750 | | | | |
Minimum Auto-Refresh to Active/Auto-Refresh Command Period, tRFC (ns) | 350.000 | 350.000 | 350.000 | 350.000 | | | | |
| | | | | | | | |
DDR4 Specific SPD Attributes | | | | | | | | |
Maximum Clock Cycle Time, tCKmax (ns) | 1.600 | 1.600 | 1.600 | 1.600 | | | | |
Minimum Auto-Refresh to Active/Auto-Refresh Command Period, tRFC2 (ns) | 260.000 | 260.000 | 260.000 | 260.000 | | | | |
Minimum Auto-Refresh to Active/Auto-Refresh Command Period, tRFC4 (ns) | 160.000 | 160.000 | 160.000 | 160.000 | | | | |
Minimum Activate to Activate Delay Time different bank group, tRRD_Smin (ns) | 3.700 | 3.700 | 3.700 | 3.700 | | | | |
Minimum Activate to Activate Delay Time same bank group, tRRD_Lmin (ns) | 5.300 | 5.300 | 5.300 | 5.300 | | | | |
Minimum CAS to CAS Delay Time same bank group, tCCD_Lmin (ns) | 5.625 | 5.625 | 5.625 | 5.625 | | | | |
Minimum Four Activate Window Delay (ns) | 21.000 | 21.000 | 21.000 | 21.000 | | | | |
Maximum Activate Window in units of tREFI | 8192 | 8192 | 8192 | 8192 | | | | |
Thermal Sensor Present | No | No | No | No | | | | |
DRAM Stepping | 0 | 0 | 0 | 0 | | | | |
DRAM Manufacture | Samsung | Samsung | Samsung | Samsung | | | | |
SDRAM Package Type | Monolithic, 1 die, Single load stack | Monolithic, 1 die, Single load stack | Monolithic, 1 die, Single load stack | Monolithic, 1 die, Single load stack | | | | |
Maxium Activate Count (MAC) | Unlimited MAC | Unlimited MAC | Unlimited MAC | Unlimited MAC | | | | |
Post Package Repair Supported | No | No | No | No | | | | |
Module Type | UDIMM | UDIMM | UDIMM | UDIMM | | | | |
Module Height (mm) | 32 | 32 | 32 | 32 | | | | |
Module Thickness (front), (mm) | 2 | 2 | 2 | 2 | | | | |
Module Thickness (back), (mm) | 2 | 2 | 2 | 2 | | | | |
Reference Raw Card Used | Raw Card A Rev. 18 | Raw Card A Rev. 18 | Raw Card A Rev. 18 | Raw Card A Rev. 18 | | | | |
| | | | | | | | |
XMP Attributes | | | | | | | | |
XMP Revision | 2.0 | 2.0 | 2.0 | 2.0 | | | | |
Enthusiast / Certified Profile | | | | | | | | |
Module voltage | 1.35V | 1.35V | 1.35V | 1.35V | | | | |
Clock speed (MHz) | 1600 | 1600 | 1600 | 1600 | | | | |
Transfer Speed (MHz) | DDR4-3200 | DDR4-3200 | DDR4-3200 | DDR4-3200 | | | | |
Bandwidth (MB/s) | PC4-25600 | PC4-25600 | PC4-25600 | PC4-25600 | | | | |
Minimum clock cycle time, tCK (ns) | 0.625 | 0.625 | 0.625 | 0.625 | | | | |
Supported CAS latencies | 15 | 15 | 15 | 15 | | | | |
Minimum CAS latency time, tAA (ns) | 9.375 | 9.375 | 9.375 | 9.375 | | | | |
Minimum RAS to CAS delay time, tRCD (ns) | 9.375 | 9.375 | 9.375 | 9.375 | | | | |
Minimum row precharge time, tRP (ns) | 9.375 | 9.375 | 9.375 | 9.375 | | | | |
Minimum active to precharge time, tRAS (ns) | 21.875 | 21.875 | 21.875 | 21.875 | | | | |
Supported timing at highest clock speed | 15-15-15-35 | 15-15-15-35 | 15-15-15-35 | 15-15-15-35 | | | | |
Minimum Active to Auto-Refresh Delay, tRC (ns) | 31.250 | 31.250 | 31.250 | 31.250 | | | | |
Minimum Auto-Refresh to Active/Auto-Refresh Command Period, tRFC1 (ns) | 350.000 | 350.000 | 350.000 | 350.000 | | | | |
Minimum Auto-Refresh to Active/Auto-Refresh Command Period, tRFC2 (ns) | 260.000 | 260.000 | 260.000 | 260.000 | | | | |
Minimum Auto-Refresh to Active/Auto-Refresh Command Period, tRFC4 (ns) | 160.000 | 160.000 | 160.000 | 160.000 | | | | |
Minimum Four Activate Window Delay, tFAW (ns) | 24.000 | 24.000 | 24.000 | 24.000 | | | | |
Minimum Activate to Activate Delay Time different bank group, tRRD_S (ns) | 3.500 | 3.500 | 3.500 | 3.500 | | | | |
Minimum Activate to Activate Delay Time same bank group, tRRD_L (ns) | 5.000 | 5.000 | 5.000 | 5.000 | | | | |



EDIT: Apologies for how it compressed when you go to read it. If you use the pipe character | as a delimiter instead of a comma, you should be able to read it more properly as an imported CSV file into Excel (or some other spreadsheet that can import CSV data)

 

[xeon_fan]

Shrapnel_indie thanks for the input.
Now I know much more:
[strike]- is it Samsung or Hynix ? [/strike]- Samsung
[strike]- is it SS or DS (according to ASUS QVL it is SS) ?[/strike] SS <confirmed>
[strike]- is it Single rank or dual rank ?[/strike] Single Rank (SS is always Single Rank)
- is it (if samsung based) legendary b-die? <?unknown?>

Passmark neither CPUiZ will not answer if it is Samsung B-die or not 🙁

 

[xeon_fan]

Based on checks ... F4-3200C15-8GVK stick is samsung b-die ... (SS, SR)

@shrapnel_indie thanks for helping