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Exactly hector and what blazorthorn surprisingly doesn't know is that they DO have two teams working on die shrinks. They don't start 14nm after getting 22nm out. They started 14nm 2 years ago to be ready in 2014. Intel has built many fabs and has the ability to do simultaneous development. It just isn't always so easy as just shrinking the die. There are all sorts of design issues that have to be addressed with every die shrink. Materials science problems often arise in these die shrinks amongst others. Intel, in fact, according to them, are already researching nodes beyond 14nm in their labs for 2016 and beyond. My guess is that they are pretty much finishe with the 14nm process and are producing experimental DRAM modules or even nand modules amongst others to ensure the process is working correctly before they put Broadwell into full production in 2013.
I'm not so sure GF is anywhere near that close since just a year ago they decided to go gate last and are recently (as in 2 years ago) decided to go FinFET (even if it's planar) with the 14nm shrink. They have serious obstacles to overcome in my opinion. I still think 2014 is very optimistic but I will wait and see.
I'm not so sure GF is anywhere near that close since just a year ago they decided to go gate last and are recently (as in 2 years ago) decided to go FinFET (even if it's planar) with the 14nm shrink. They have serious obstacles to overcome in my opinion. I still think 2014 is very optimistic but I will wait and see.