Your reply is much thoughtful and analytic if I may say so, really appreciate.
Dumping air outside the case is about the only advantage something like an H60 would have, and its not that large of a change in internal temps. However, by moving the air outside the case you effectively starve the VRMs and other motherboard chips of airflow, so it is a trade off.
120mm AIOs are just straight up worse than comparably priced air coolers otherwise.
I see your point about the VRMs and remaining components being starved with cold air when all the good air is pulled out of the case leaving the hot components without air to breathe, this is something I have not thought about before.
Regarding the H60 though, I am using it for my old i5. The chip rose to 60 degree C after overclocking to 3.8 GHz. If I keep holding myself from overclocking the chip, I trust the H60 will continue to do a good job for 4 cores chip, maybe it will fail for 6 or 8 cores chips.
We see front mounted AIO with rear/top intake quite often, and it generally results in worse temps. Heat rises, and your GPU is blowing air up and around in the case, so it prevents air from reaching downward. Overall airflow is improved by going conventional.
Well, about the said configuration I see too many of them in YouTube videos. I doubt if they actually work well and you just confirm my guessing.
Typical configuration is like the whole kit is mounted at the front with the rad behind the fans so the fans are facing out and the rad is inside the case. When the fans start revolving, pulling cold air in, the cold air is mixed with the hot air from the rad and because of the pull resulting warmer air is delivered into the case and joins the hot air radiated from the back of the graphics card. This is where the problem arises. Had it not because of the warm air from the radiator, cold air would have joined the hot air to form the resulting temperature which should theoretically be cooler.
I would more inclined to think that the rad be placed at the top or in the case of CM Q300L, even at the bottom.
You also make a very good point about the recycling of air. Indeed, that's something which require further considerations. As I mentioned above, something like the Q300L is perhaps a better solution as it get perforated front, top and
bottom panel which allows air to penetrated through without the filter. And the case must be elevated by some sort of stand instead of placing it on the table so the whole cubic can have air coming through and going out.
Front intakes are fairly good at lowering GPU temps, so long as the graphics card cooler itself is up to the task.
This is the second purpose of this thread, and you sort of confirm my thinking. Though theoretically all the conventional cooling configuration claims their merits of achieving good thermals, but in fact such configuration simply provides the basic needs for heat dissipation of the whole case. Whether they actually capable of cooling the graphics is unknown. no solution!
Better alternative is like what the Bitfenix Prodigy (very old vase) offers, the board lies on a horizontal manner with the graphics board standing vertically. The side panel to the graphics board is perforated, to help pulling cold air from outside right on to the graphics board.
But then, recent years, no such cases are produced.