Between generations, sometimes the die height changes. With Skylake, the PCB got thinner, which required a thicker IHS to work with the same heatsinks and mounting mechanisms vs earlier generations. So, no, it won't necessarily carry forward.
Why not delid your CPU and run bare die? I can't see much point in going through the trouble of building an expensive IHS replacement out of exotic materials. For years, I ran with a high-end waterblock bolted directly to the bare die of my i5, but honestly the lower temps did nothing, and I regret even delidding it because it has no resale value anymore. I now have the IHS reattached, with CL Ultra TIM, and a low profile cooler, and everything works just as well as with bare die watercooling. I...