Hi,
I am just wondering how I should apply the liquid metal when the CPU and IGPU are on close position on an intel chip.
For example:
https://hothardware.com/gallery/Article/2469?image=big_skylake-core-i7-6670hq-skull-canyon-nuc.jpg&tag=popup
Does it even do something if both surfaces (cpu/gpu) get in contact via the application of the liquid metal ; or it is imperative they don't touch each other ?
I plan to apply electric tape all around it, shall I emphasise their separation on the board as well or not, thanks!
I am just wondering how I should apply the liquid metal when the CPU and IGPU are on close position on an intel chip.
For example:
https://hothardware.com/gallery/Article/2469?image=big_skylake-core-i7-6670hq-skull-canyon-nuc.jpg&tag=popup
Does it even do something if both surfaces (cpu/gpu) get in contact via the application of the liquid metal ; or it is imperative they don't touch each other ?
I plan to apply electric tape all around it, shall I emphasise their separation on the board as well or not, thanks!