News Huawei Turns To 3D Chip Stacking To Evade US Sanctions

jkflipflop98

Distinguished
Feb 3, 2006
1,702
144
19,970
3
The author of this article is mistaken. F2F (face to face) stacking methods are nothing new. Their problem is they have incredible heat buildup as all the thermals are contained inside of a tiny strip that's sandwiched in between the silicon substrates of the die. It acts like a blanket keeping the heat inside. Terrible for thermals and that's why no one else does this.
 

KananX

Prominent
BANNED
Apr 11, 2022
615
139
590
9
It’d strange if they could circumvent the export restrictions with this, but if yes, kudos to them for their creativity. The export restrictions don’t make much sense anyway.
 

ASK THE COMMUNITY