News Huawei's quad-chiplet rival for Nvidia's Rubin AI GPUs could use packaging tech that rivals TSMC — Ascend 910D rumors have seemingly solid foundation

[Admin]

Huawei has reportedly developed a chip packaging process technology for its Ascend 910D processor that is comparable to TSMC's leading-edge CoWoS technology.

Huawei's quad-chiplet rival for Nvidia's Rubin AI GPUs could use packaging tech that rivals TSMC — Ascend 910D rumors have seemingly solid foundation : Read more

 

[Geef]

Another story where a certain country's chip COULD rival, or MAY, POTENTIALLY, POSSIBLY, FEASIBLY rival the best out there!
Uh, yeahhh...

I wonder if lawyers are specifically trained for making contracts with that group's companies? To find all the MAYBEs and get them written out with specifics?