IBM promises cooler chips with capillary-action and water jets

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IBM's Zurich labs have developed a new heatsink and water-cooling that promises to cool chips up to six times better than conventional air cooling. The heatsink contains tiny channels similar to the capillaries you would see in tree leaves and in human circulator systems. The channels allow either water or heatsink compound to spread more uniformly and thereby dissipate more heat.

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