Intel has entered a joint development agreement with Corning to develop ultra low thermal expansion (ULE) glass photomask substrates required for Extreme Ultraviolet (EUV) lithography and semiconductors with transistor structures smaller than 40 nm.
Intel and Corning to develop EUV photomask substrates for 32 nm production : Read more
Intel and Corning to develop EUV photomask substrates for 32 nm production : Read more
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