News Intel CEO: Meteor Lake Will Be Our Next 'Centrino Moment'

[Admin]

Pat Gelsinger talks PC market, ample opportunities provided by demand for AI.

Intel CEO: Meteor Lake Will Be Our Next 'Centrino Moment' : Read more

 

[bit_user]

For AI acceleration to really gain strong market penetration and become a "must-have" feature, what you need is for it to be as ubiquitous and seamless as Direct3D acceleration. I'm not sure we're there, yet.

 

[Jimbojan]

Intel did not make a profit last quarter, it recovered the tax it paid from previous years to make a profit, although Intel did invest many $billions in its factories to cause this loss. By the way, AMD also lose money last quarter, also recovered from previous taxes, but AMD has hardly paid any taxes in the previous years, so it cannot recover much money ($27M). What is interesting is that Intel has caught up with TSMC in manufacturing process; in fact, Inel 4 is ahead of AMD's 5nm processor with TSMC, thus, Intel's Meteor Lake will have a better power efficiency than AMD's chips in additional to its higher performance, which is a first in the last 3 years. This trend will be continuing for the foreseeable future as Intel 3 and 18A will be the leader in the market place; AMD will fall behind again from here on. That is because Intel invested heavily in hardware fab and design, plus the software ( Intel’s OneAPI), no one will be able to compete shortly.

 

[Eximo]

Intel did not make a profit last quarter, it recovered the tax it paid from previous years to make a profit, although Intel did invest many $billions in its factories to cause this loss. By the way, AMD also lose money last quarter, also recovered from previous taxes, but AMD has hardly paid any taxes in the previous years, so it cannot recover much money ($27M). What is interesting is that Intel has caught up with TSMC in manufacturing process; in fact, Inel 4 is ahead of AMD's 5nm processor with TSMC, thus, Intel's Meteor Lake will have a better power efficiency than AMD's chips in additional to its higher performance, which is a first in the last 3 years. This trend will be continuing for the foreseeable future as Intel 3 and 18A will be the leader in the market place; AMD will fall behind again from here on. That is because Intel invested heavily in hardware fab and design, plus the software ( Intel’s OneAPI), no one will be able to compete shortly.

This assumes that everything remains as it is and all projected targets are met for mass production. Would not be the first time that we've been promised a node or release that ends up delayed.

TSMC is not going to sit around doing nothing either. '3nm' already available to Apple, won't be too long before Apple switches to the next improvement. AMD could even switch to Intel as a fab when their capacity becomes sufficient. Not that Intel would be a huge fan of that, but if they have the capacity and a willing customer...

All speculation until the products exist for review.

 

[DaveLTX]

This assumes that everything remains as it is and all projected targets are met for mass production. Would not be the first time that we've been promised a node or release that ends up delayed.

TSMC is not going to sit around doing nothing either. '3nm' already available to Apple, won't be too long before Apple switches to the next improvement. AMD could even switch to Intel as a fab when their capacity becomes sufficient. Not that Intel would be a huge fan of that, but if they have the capacity and a willing customer...

All speculation until the products exist for review.

3 things that is counter to that :
First, IFS is now wholly independent to the design team. Which is why the design team is struggling to get to grips with the new way of doing things. In the past they simply asked production to tweak the process until they wrangle some life into the chips. Therefore the umpteen amounts of node revisions and steppings.

AMD has a very strong relationship with TSMC for packaging as well, simply switching to Intel is not entirely feasible due to packaging reasons.
However, SRAM density on Intel 4 is still behind TSMC N5 and will result in larger CPU dies on everything. Especially 3D v cache.
And a bigger die and lower density also means more latency and less efficiency

Therefore, claims of higher efficiency is not entirely sound. This was also Intel's old metric boast (SRAM density) when comparing TSMC N7 and what was Intel 10 which they later loosened extremely to make Intel 7 for alder lake
So in other words, I don't buy it. Samsung also claimed higher density from their nodes but where are the results?
Given modern CPUs and GPUs are mostly SRAM, Intel 4 doesn't look more efficient, or even area efficient. I suspect that was the main reason behind using "atom class cores" because they're trying to save area but Intel being Intel doesn't think out of the box

 

[Co BIY]

All speculation until the products exist for review.

True statement.

And then compared with the contemporaneously available competing product.

 

[JayNor]

PVC includes 408MB of L2 SRAM . 288MB of it is on the two base tiles.