Not really, realistically they only need to achieve parity with what tsmc has, and not even 100% parity but just close enough.
This is flat out wrong for leading edge because none of the foundries can afford to undercut enough. You can see how this has played out with Samsung vs TSMC and how many big orders Samsung has gotten on their EUV nodes (it's zero outside of in house).
Intel already proved that they can translate intel products to tsmc manufacturing with arrow lake which means they can do the other way around as well.
Lion Cove and Skymont were already on N3B with LNL which means a lot of the work was already done when they switched ARL from 20A to N3B.
Companies going to intel as a 'second source' supplier to lower the danger of delays if not outright losing shipments or just to get more wafers quicker is all intel needs to at least make good business.
I'd love to know how you think the economics of this works out with a leading edge node. Can you find a single example of a company doing this on EUV nodes?
Also BSPDN is an optional feature of 18A, but I don't believe GAAFET is which means extra design work on top of the existing to go between nodes.
Every big release in the last years has been extremely limited because they just can't get enough wafers.
This isn't really accurate* outside of Intel's MTL launch, but that is directly related to amount of available EUV machines. Leading edge nodes cost a
lot and in general time between releases are going up so it seems pretty apparent that several companies are being conservative with wafer buys.
*The crypto/COVID buying spikes shouldn't be considered in a long term business conversation in my opinion.
Being even better would just allow them to charge more so of course they would want that but it's not really needed.
It's not about charging more it's about getting big enough contracts to keep the fabs running. If they're not offering something the companies cannot get somewhere else then there's little reason to go with Intel yet. If they nail the execution of 18A then they can absolutely leverage execution and don't have to worry as much about competition comparison.
Intel 3 appears to be a good node, but it's also only been used for in house Intel parts (GNR/SRF/MTL refresh). So while this says Intel can execute with an EUV node it says nothing about their ability to execute an external design at volume.