News Intel Now Content To 'Match' TSMC's Process Technology

May 31, 2019
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Intel and TSMC are both waiting on ASML EUV equipment that meets the requirements for high volume production. Good luck if you're betting high volume production on a limited resource.

"The big news from ASML Q3 report is the shipment of the first NXE:3400C systems. We consider the 3400C to be the first fully HVM-oriented systems."

"At the current production rate, orders placed in Q4 won’t be fulfilled any earlier than mid-2021. It’s currently unclear what impact, if any, the large backlog in EUV machines will have on foundry roadmaps."

 
May 31, 2019
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Intel's 22FFL process enabled the ultra low leakage io layer of their new Lakefield chip that is designed into Surface Neo next year. That 10nm chip also demonstrates Intel's Foveros 3D manufacturing capability for logic, which Intel claimed to be production ready in Dec 2018. I don't see any similar product on the roadmap from AMD/tsmc.
 
May 31, 2019
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Intel's 22FFL process also enabled a very high retention automotive temperature STT-MRAM product, which this article states is a leading feature.

"As far as retention goes, Intel reported 10-year retention not only at the Grade 2 automotive temperature range (-40 to 105 °C) but also at 200 degrees C for 10 years which is much higher than anything else we are aware reported to date."

 
May 31, 2019
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Intel and Micron together developed a process for 3DXpoint. I haven't seen any response from AMD/TSMC.
 

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