The only thing we do know about the BMG-G31, for now, is that it is set to come in ba a grid array package with 3283 balls (BGA3283), which likely points to the fact that the G31 is Intel's new flagship that has a vast memory bus and a sophisticated power delivery circuitry.
That said, it looks like Intel's BMG-G31 will be Intel's new flagship graphics processor.
We discussed on this topic before as well, in one of the
previous articles.
YES, as per BGA array configuration of 3283 pins, the G31
should be the high-end processor, but if we go by Intel's own naming convention logic, it could be one of the lower end part as well.
Because, take the ARC Alchemist lineup as an example. The top flagship die was the "Arc ACM-G10", which came with 32 Xe cores. And the ACM G11 and G12 dies were the lower end parts, respectively. So based on this logic, the G31 is not the flagship die.
But again, nothing is certain, and there is some confusion right now.
Both the theories contradict each other. Because, if we assume the G31 is indeed the smaller or an entry-level die, then why is the BGA 3283 array package being used for it ? So many questions, no definitive answer yet !
Because the article itself claims,
"The BMG-G10 is presumably designed for higher-end graphics cards, and the BMG-G21 is presumably aimed at entry-level graphics boards."
By the way, some BMG G21 entries were also spotted. Intel seems to be testing active-fan heatsinks with these ES/engineering samples.