You know what I love about MIL-STD-810G? It basically says: "Determine how the device will be used. Test to verify that it will work in these conditions."
You know what's even better? No one checks to see if any given product actually complies with the standard. Anyone can slap "complies with MIL-STD-810G" on their product, even if they've never actually read it.
That said, the standard does require companies to disclose the specific tests that were performed on the product, if any test were indeed performed.
Main difference I see between this and the Titanium will be the Clock Generator. Aside from that they will be nearly identical with different color schemes. The lower overclockable memory support is a bit of a let down considering the other 2 X370 boards support DDR4-3200. The memory on MSIs boards are overbuilt so they should be stable much higher. I think the difference between now and March was that we didn't know how far AMD will push their support for memory standards. Right now on the Titanium I can almost get 2667mhz stable with 4 dimms. If they meant the memory can do that with 4 dimms, that would be pretty good.
For an X370 board right now, I would like an ITX with 1 PCI-e x16 3.0, NVMe, USB 3.1 Gen 2 Ports for Front I/O, 2 memory dimm, Wifi. Everything else would be superfluous.
Ryzen 7 + x370 chipset = 40 PCI-e 3.0 lanes and 8 PCI-e 2.0 lanes. It also has 2 dedicated lanes for NVMe. Guess it just depends on how they split that up. Considering they have 2 PCI-e lanes for GPUs, they may have went with a x16 or x8/x8 design. Each m.2 turbo is a x4. So it should be enough considering those lanes are also used for everything else.
If they designed it for Ryzen 9, then it should have 24 more PCI-e 3.0 lanes w/ 2 dedicated for NVMe.