News NEO Semiconductor develops 3D DRAM with AI processing — new tech eyes to replace current HBM tech to solve data bus bottlenecks

[Admin]

3D DRAM HBMs with built-in AI processing are slated to deliver a 99% improvement in power efficiency.

NEO Semiconductor develops 3D DRAM with AI processing — new tech eyes to replace current HBM tech to solve data bus bottlenecks : Read more

 

[Evildead_666]

If this works it would be one hell of a speedup to current processes.