The migration from plastic ball-grid array (PBGA) to flip-chip (FC) packaging for northbridge chips will not proceed much further this year, as VIA Technologies, ATI Technologies and Nvidia will continue using PBGA packaging for their solutions, according to industry sources.
Northbridge migration from PBGA to FC packages on hold until cost drops : Read more
Northbridge migration from PBGA to FC packages on hold until cost drops : Read more
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