You thermal paste "pattern" is completely wrong. So that's one problem.
Are you using the stock cooler?
What is the EXACT motherboard model number?
How many case fans do you have, where are they located and how are they oriented (Intake=air into case, Exhaust=blowing out of case)?
You don't need the "balanced" power plan. That and power saving are intended more for mobile devices and laptops. Change the plan to performance. Then click next to the plan where it says "change plan settings". Next, click where it says change advanced power options. Then, scroll down to processor power management and change the minimum to 8% and leave the maximum at 100%. Make sure the cooling profile there is set to active.
Save settings and exit the advanced power options.
Restart and go into the BIOS. Find the settings for AMD Cool N' Quiet and make sure it is ENABLED. If it is not, enable it. Save settings and exit BIOS.
All of which needs to be done, obviously, after you re-mount the CPU cooler. If this is a stock cooler you want to use a blob about half the size of a dime, dead center, because the stock coolers are low mounting pressure. If it is a high mounting pressure aftermarket cooler which uses a different backplate and mounting system (And does not use the stock mounting hardware, clips, etc.), they you want to use a blob about the size of two large grains of rice, dead center on the CPU lid.
These instructions were intended for help with the Hyper 212 EVO, but you will find pasting instructions there which should be helpful in eliminating pasting techniques which are not recommended.
Prior to establishing the mounting pressure you'll need to have already applied your thermal paste and although opinions regarding the correct amount vary as widely as you can imagine, the old adage about opinions being like a very distinctly distasteful body part would certainly seem to apply here. Everything from five very small dots to slathering it on with a credit card, using a pea sized dollop, the three line method and possibly anything else up to and including drawing a smiley face have been not only mentioned in various circles but almost certainly tried in reality as well.
-Some methods "Recommended" around the web-
-The likely, but undesirable results of those methods-
I don't recommend any of those, and to clarify, I'm not claiming to be an authority or trying to indicate there is no other way but mine, but it is one that has worked on literally hundreds of builds over the years without issue.
I personally prescribe to the uncooked rice grain sized application when using any of the commonly available pastes that come in a tube applicator like the Arctic Silver 5 or most of the included pastes that come with premium coolers. If you are using a stock, low pressure mounting system type cooler like those which use the stock mounting hardware and backplate, you will want to probably use double the amount of thermal interface material (paste) because the low pressure will not effectively force the paste outward from the center point nearly as much as aftermarket high mounting pressure coolers do.
I've never had excess paste squeeze from between the CPU lid and heatsink using this method nor had an issue with inadequate cooling due to any lack of sufficient TIM. You can make your own decision on what works best for you. Depending on the cooler, a very small snow pea sized dab will work well too, so long as you don't get carried away or misconstrue the definition of snow pea. For our purposes, perhaps a dab about 1/3 the size of a number 2 pencil eraser is a better description.
-More promising methods-
-Probable results-
Notice that even with this method there is substantial filling of the heat pipe seams. It is NOT necessary to lay multiple lines along seams.
Nearly every novice builder thinks more will be better, until they learn for themselves how wrong that way of thinking truly is. The paste is only there to provide a thermal interface between the metal of the cpu lid and the base of the heatsink. It's only job is to bridge any convex or concave tendencies of the lid or heatsink base and to fill microscopic pores in either surface.
It's not there as a magic cooling pad and it's use would actually be entirely unnecessary were both surfaces to be completely flat and non-porous. But since that is unlikely, a thermal interface material is required.
(As home mechanics, handymen, tinkerers and especially with guys in general, we tend to want to always do a little extra. An extra turn on that bolt, which causes it to break. An extra half gallon in the gas tank, which overflows and slowly eats your paint away.
The list goes on but in this instance you'll want to to avoid the inclination to add any "extra" or "just a little bit more" when applying the paste. One small strip in the dead center, the size of a large cooked grain of rice or two small uncooked grains of rice at most, dead center, is plenty to fill the needed areas when the heatsink is tightened to the correct specifications using the recommended tightening procedure.)
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