News Pink thermal paste launches with TIM 'caulk gun' for application — thermal gel designed to replace thermal pads, fill voids between components

[Admin]

Clock Work Tea Party made a thermal paste with a 'caulk gun' for paste application

Pink thermal paste launches with TIM 'caulk gun' for application — thermal gel designed to replace thermal pads, fill voids between components : Read more

 

[bit_user]

One nice thing about thermal pads is that they tend to be a lot easier to remove than paste. I hope that "thermal gel" hardens into chunks that you can dig out, otherwise... what a mess!

I also don't love that photo of its application, since one should try to apply TIM in a way that minimizes the chance of air pockets forming between a component and the heatsink. If trying to fill gaps between components, I'd do that first. Not to the same fill height as the components, themselves. Then add globs atop the components, as it's most important to have that more direct coupling between the component and the heatsink.

However, I'm a bit skeptical of how much is actually gained by filling in the gaps between components, TBH.

 

[thestryker]

While that definitely looks messy I also wonder about the separation potential as a lot of the stuff used to fill bigger gaps over time can start to separate some. That isn't dangerous to the components, but makes the cleanup even harder than it already looks to be. I still wish there was a proper replacement for TG-PP-10 as that was fantastic to use and doesn't seem to have an equivalent on the market.