Questions about new hsf prep/installation

Superhal

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Sep 17, 2008
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Hi all,

i've never wanted to OC before, but my setup (9750, M3A) is just so horrible (compared to the Q6600 stock) that i'm going to try for a 3.0 ghz OC.

my new HSF should be coming soon (Sunbeamtech Core Contact Freezer w/IC Diamond 7) and I had a few questions about installation.

1. HSF lapping: i'm relatively sure that the sunbeam won't benefit from lapping, since it's not concave/convex. anybody tried?

2. CPU lapping: while the intel concavity is well-documented, how about the phenom?

3. pressure: i know the sunbeam comes with AM2 mounting clips, but i'm not sure if it will give sufficient pressure. (http://www.innovationcooling.com/Indepandentuserpressuretest.htm) should i get the backplate mount?

thanks for replies.

 

Superhal

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Sep 17, 2008
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i got my heatsink, here's what happened:

1. both the cpu and hsf need lapping. the cpu has a raised middle and edges, while the hsf's pipe spacers are raised over the pipes.

2. i didn't lap, because i wanted to see how well it performed without lapping.

3. installation wasn't easy. the am2 clip gives ridiculous pressure. i had to take out the power supply and graphics card to get my whole hand in there. (Later, I found it was much easier just to use a wrench.) What did happen though was that the TIM was smeared all over the place, and probably a bunch of air bubbles were introduced. i had to remove my side case fan, and cut off one of the fan mounts.

4. Testing discoverd that the maximum voltage my bios can give is 1.36v. testing at this level showed little or no chance to overheat. I started oc'ing, and settled at 2.88ghz, 1.30v stable.

5. further testing revealed that the orientation (blowing into the case) was causing other components to overheat at load (it would keep them cooler at idle.) so, i reversed the orientation.

6. currently burning in the tim. temps seem higher than with the reverse orientation, but i won't know for sure until the tim settles.