Lapping:
From what I heard the new Ryzen 7000 series has an extra 2mm IHS thickness for cooler compatibility; it seems that you would be able to lap the cpu 2mm to achieve much better thermals. This would serve as an alternative to delidding as that is quite a risky endeavor even with the correct tools. Though I am unsure about the best way to lap the cpu 2mm. Doing it by hand would take absolutely forever even with a low grit sandpaper. While using a machine would be efficient, it won't necessarily provide the flattest lap if you aren't careful; there would also be problems with holding the cpu in place and making sure not to overheat the cpu from the material being removed.
The cooling problem:
With the 2 mm difference most coolers would then not seem to fit (hence why AMD seemingly made the IHS so thick for am5). It seems that any cooler that uses standoffs to modify the height of the cooler would be able to make up the difference by simply using different standoffs. Most AIOs use standoffs and you should be able to simply get standoffs that are 2 mm shorter than the ones provided or modify the included standoffs by removing 2mm of material. Though this might become less of a problem with the am5 bracket adjustments that will be released for the majority am4 compatible coolers.
Reason behind this:
I am planning to build a mini-itx pc with the new 7700x but I would rather not have the processor hit 95c at all, especially when I might have cpu heavy tasks open for 4+ hours at a time. The high temperatures have a ton of disadvantages: higher power draw, possible effect on the longevity of the cpu and less overclocking potential. With this simple fix, the processor could drop up to 15c. Combine this with undervolting and you get the same performance with the cpu at probably about 50c (estimate based on 7000s undervolting video, which demostrated that the cpu dropped to under 70c while staying at the same performance level). Also helps with the hot air output from the case making it less of a heater and more of a computer.
Hopefully this is useful for anyone else hoping to improve temps without the danger of killing your cpu with delidding.
From what I heard the new Ryzen 7000 series has an extra 2mm IHS thickness for cooler compatibility; it seems that you would be able to lap the cpu 2mm to achieve much better thermals. This would serve as an alternative to delidding as that is quite a risky endeavor even with the correct tools. Though I am unsure about the best way to lap the cpu 2mm. Doing it by hand would take absolutely forever even with a low grit sandpaper. While using a machine would be efficient, it won't necessarily provide the flattest lap if you aren't careful; there would also be problems with holding the cpu in place and making sure not to overheat the cpu from the material being removed.
The cooling problem:
With the 2 mm difference most coolers would then not seem to fit (hence why AMD seemingly made the IHS so thick for am5). It seems that any cooler that uses standoffs to modify the height of the cooler would be able to make up the difference by simply using different standoffs. Most AIOs use standoffs and you should be able to simply get standoffs that are 2 mm shorter than the ones provided or modify the included standoffs by removing 2mm of material. Though this might become less of a problem with the am5 bracket adjustments that will be released for the majority am4 compatible coolers.
Reason behind this:
I am planning to build a mini-itx pc with the new 7700x but I would rather not have the processor hit 95c at all, especially when I might have cpu heavy tasks open for 4+ hours at a time. The high temperatures have a ton of disadvantages: higher power draw, possible effect on the longevity of the cpu and less overclocking potential. With this simple fix, the processor could drop up to 15c. Combine this with undervolting and you get the same performance with the cpu at probably about 50c (estimate based on 7000s undervolting video, which demostrated that the cpu dropped to under 70c while staying at the same performance level). Also helps with the hot air output from the case making it less of a heater and more of a computer.
Hopefully this is useful for anyone else hoping to improve temps without the danger of killing your cpu with delidding.