News Samsung races to beat Intel to market with glass substrates for chips — revolutionary tech boosts processing capabilities

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While the article speaks about mechanical stability, I am wondering about mechanical strength? Because it's glass, it sounds fragile and I am thinking that might be a reason Intel has been working on it for 10 years and is looking at bringing it to market by 2030.
 
While the article speaks about mechanical stability, I am wondering about mechanical strength? Because it's glass, it sounds fragile and I am thinking that might be a reason Intel has been working on it for 10 years and is looking at bringing it to market by 2030.
Glass actually has a very high tensile strength when rigorously manufactured without flaws. https://en.wikipedia.org/wiki/Strength_of_glass
 
So a glass substrate is better than an organic substrate. What about conventional silicon substrates? Why is there no comparison provided in the story? Better to build a house out of paper instead of ice cream, but you might want to mention wood in the analysis.
 
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So a glass substrate is better than an organic substrate. What about conventional silicon substrates? Why is there no comparison provided in the story? Better to build a house out of paper instead of ice cream, but you might want to mention wood in the analysis.
So…I’m probably wrong, but I got the idea that it would replace the PCB substrate rather than replacing silicon.
 
my concern is if its normal glass its fragile & if its tempered glass it could randomly shatter (you see rare cases of glass side pales randomly shattering as its a rare flaw in tempered glass) & how warranty would work should those rare cases happen to ppl ;/
 
So…I’m probably wrong, but I got the idea that it would replace the PCB substrate rather than replacing silicon.
That's roughly correct. The standard microprocessor packaging substrate is some kind of fiber glass composite, which is similar to what PCBs are made with.

Silicon would be ridiculously expensive to make it a package substrate material, which has to be large and thick.
 
While the article speaks about mechanical stability, I am wondering about mechanical strength? Because it's glass, it sounds fragile and I am thinking that might be a reason Intel has been working on it for 10 years and is looking at bringing it to market by 2030.
You'd be surprised what kind of fragile materials are already used in microprocessors, like foamy glass-like materials in the dielectric layers. Ultimately semiconductor manufacturers have to certify their products against standard testing, which involve various mechanical and thermal tests. During the engineering of these technologies, these are entirely considered during development.
 
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