The Flirc case appears to be an all encompassing aluminium shell with soft touch panels on top.Had it been available at back in December, I'd've definitely considered this for my Pi4 in lieu of the Flirc case, though thus far, I have ZERO complaints about the Flirc.
The great thing about thermal pads is that you can just stick the heat sinks on. When using proper thermal paste, a mechanical means for attaching the heat sinks is also needed...Also, people would do well to use copper heatsinks with more surface area + a decent thermal compound!
Theoretically, yes.The great thing about thermal pads is that you can just stick the heat sinks on. When using proper thermal paste, a mechanical means for attaching the heat sinks is also needed...
I don't expect them to do it - it takes valuable, precious space. They're battling for every mm^2 of the board area. I've read that a prototype of Raspberry Pi 4 was 5mm longer (in the longer dimension) and the've been optimising itt for half a year to shorten it. The movement of an ethernet jack to the other side was necessary......
When the stakes are comparatively low and everything is sitting flat, you can get away without a mechanical means of securing the heatsink.
However, I do hope that Pi v5 has a pair of screw holes on opposite corners of the CPU, to support a mechanical restraint. I would prefer to do it "the right way", even if I think I could probably get away with something less.
I was just saying what would work better than Silverstone's solution - not that it would be perfect.Your idea would help only if it were useful to install a heatsink smaller than the board. That's not the case - any decent coolercase needs to cool by its chassis to gain surface area. Any small heatsink inside a case is worthless. And with the 3-8W power budget, you need something between this size (SilverStone case) and CooliPi on the upper side of the size spectrum.
Eben Upton said in a Q&A on this site, just over a year ago, that they expect to stay on 28 nm for a couple more generations, at least. He said it currently offers the lowest cost per transistor, which is what they're optimizing for.with any future process technology RPF could pay for, we power users will demand to get the most of it.
Yes, cooling will likely continue to be a limiting factor.And that means (again) the biggest heatsink money can buy.