alextheblue :
Until we see a teardown and power tests, we don't really know if a shrink or other power-saving measures have been implemented or not. Anyway these things don't really chew up that much power in use, and none/virtually none when "off"
They said it uses the same components. I took that to mean no die shrink, but I guess they might've meant only that the functional specs are the same.
As for power usage, it's covered pretty well on wikipedia:
https://en.wikipedia.org/wiki/PlayStation_4_technical_specifications#Power_usage
250 W is a lot, when you think of this as a set top appliance or a HTPC. Even the 151 W measurement they listed will heat up a small room. And it's enough heat that I'd be concerned about fan noise - especially in a smaller chassis. Remember, it had a rather large APU, for 28 nm.
10tacle :
Are you serious? A die shrink on the same generation console? Yeah THAT makes financial sense for both AMD and Sony. New fab = new mainboard needs just like in PCs. You do realize the PS3 went from the original "Fat Boy" from its Fall 2006 release to the "Slim" in its Summer 2009 release, right?
Try some fact checking, before making such indignant posts. PS3 launched at 90 nm, in Nov 2006. Less than 1 year later, they already had a respin at 60 nm. By 2009, they were down to 45 nm!
https://en.wikipedia.org/wiki/PlayStation_3_technical_specifications#Configurations
The volumes are high enough that it would
absolutely make financial sense for Sony to do a respin on a smaller node, not least because it lets them use a smaller PSU and less cooling. The only wildcard is the new PS4 Pro, and how many of those they expect to sell vs. the Slim.
10tacle :
And regarding power use and heat output, my gaming PCs make these consoles look like a tablet drawing from the wall and pumping out heat by comparison.
But they're
not gaming PCs, nor would I want one in my living room.