[citation][nom]Turranx[/nom]In three out of the four images of the products in use (above) the hot air is being blown back into the case. That makes no sense to me.[/citation]
Actually the pictures are correct. When using LC, you want the coolest air blowing over the rads and outside air will always be cooler than the air in the box (unless you are using a AC to vent directly inside your box, at which point would be kind of silly to LC). Though the ambient temp inside the case may rise a degree or two, the chips will actually run cooler since the heat exchange happens at the rad instead of a heatsink on the chip, which is the main goal.