TEC build log start

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toolmaker_03

toolmaker_03

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Mar 26, 2012
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http://imgur.com/cd15M1a
ok so I have finished all my testing and decided on a general build for this unit.
this build will be sealed inside of a chest so I will not have physical access to the computer case, I would like some input on the general idea that I am presenting, I use antifreeze so freezing the coolant is not a issue, and seeing as I am increasing the cooling capacity of my water cooling system, I have also chosen new clocks for my hardware, the CPU clock will run at 5Ghz, and the GPU's will be running at 930Mhz, I have already tested theses clocks and found them to be stable for my hardware.
 
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ok so I have decided to use some G-skill 2133Mhz memory for this build because with the new higher clocks on the hardware the system will benefit from the greater bandwidth of this memory.
looks like my power consumption will be around 2100W total for this build at load, now that's funny. :lol:
so yea, I guess that I should shut this thing down when I am done playing on it.
I have literally used every single fitting I own for this build, it looks like I have everything I need, so I should be good to go when I start cutting tubing to get this up and operational, I like to dry fit every thing without tubing, to see if I have accounted for every thing I wont to do with the water loops, and so far it looks good.
I know it may look like I just pulled this out of my *%$, but really I have been thinking about this build for years, and working on different designs for the rig, I have used a lot of the information from normal water cooling test builds, and applied that knowledge here as well.
one of the things that I have applied here is the parallel configuration of the hardware to achieve a high flow system, I think that a water chiller system needs to be a high flow system for it to function correctly.
 
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the TEC water blocks
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KWr0kg4.jpg

g6WH8aA.jpg

http://imgur.com/a/QVy4f
 
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I really don't know, but as much as possible. 😀
 
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Seeing as how they are ambient designed, have you taken into consideration the temperature limitations of the O-Ring joints of the swivel fittings?

Since those O-Rings cannot be swapped out like the G1/4 O-Ring can for lower temperature O-Rings, you might better contact the company that made the swivel fittings to see how low of temperatures they are rated to withstand?
 
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you are correct, they are not made for the cold, and I can not get to them, the best I can do is after it is all tight and in the frame the way I want, I will put a bead of RTV sealant on the outside of the joint, in the hope that if the seal fails, the RTV sealant on the outside of the joint will hold. its not the best answer, but its all I got.
I really don't have a good fix for this issue.
 
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if you have any ideas that would help me to seal the rotary section of the fittings a little better, please let me know, I would like to have a good fix for this issue.

 
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http://imgur.com/fhiqykN
ok so how do I build the frames.
first I cut the material to length I have 4 different types of aluminum angle and a length of flat material for a total of 5 different types of material that I am using for my frames.
then I rough fit and measure for the holes for drilling I will clamp the material together before I drill it.
then I bolt it all together with small screws and nuts. its kind of like building with k'nex back in the day.
 
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ok, so with this build, I started buying stuff for it 4 years ago. and I would get it, place it in my closet, and I left it there until this past December, when I decided to pull everything out, to see how close I really was to completion of this build.
the reason I pulled every thing out, is that I was considering getting all new hardware and creating a new PC, this was going to be a costly build, in the $4000 range. so I thought to my self, how much would it cost me to complete the TEC build sitting in my closet?
after taking everything out and adding it all up, for me to complete this build on the high side was $1500, and I did it for $1000. so for me, it was cheaper to complete this build, than it was to upgrade all my hardware.
now hopefully, I will have another 3 years to get all the stuff I want for my next PC build.
 
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http://imgur.com/K9pEtPv
K9pEtPv.png


ok so here is one of the things that I will be playing around with.
I will try to explain this ok so I will have clay on the cold side CPU water blocks I will stop the clay right at the TEC's cold side.
by doing this I know that there will be a layer of ice forming on the clay right around the TEC.
I will add clay the first time to bring the clay to the center of the TEC. and see what that does.
if it's not enough I will add another layer of clay and bring the clay to the end of the hot side of the TEC.
my hope is that at some point, I do not have Ice forming on the clay but only water, I do not want to cover the hot side water blocks at all.
 
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one of the fun things about this build is all the thermal dynamics going on, keeps me busy thinking all the time.
here is another thermal issue that I am and will deal with.
the pumps for the cold side of the loop are D5 water pumps, and these pumps are cooled by the liquid going through them, there is a possibility that the liquid will be too cold, and the pump will get too cold, I am covering the entire water pump in clay, and I will have a temp sensor on the pump motor to see how warm it is staying.
what if the pump still gets too cold? I have considered using a small pond heater attached to the back side of each pump, to fix the issue, I have also considered changing the pumps out for DDT pumps, and getting the air fin upgrade for them, installing a couple more fans to keep them cool, as they run a lot hotter than the D5.
see what I mean by all the fun thermal dynamics occurring within a system like this. :bounce:
 
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system stability, what's that, and how do I achieve it?
well first I clock the hardware to the desired clock rate than I test it first I run 3DMark than I would run the intel burn test.
if the system passes both of these without issue I will format the system and reinstall the OS at the new clock rates.
to me if I cant install the OS with the new clocks chosen than it is not truly stable.
so if the system passes 3DMark and the burn test with the processor at 5Ghz, the video cards at 930Mhz, and the memory will be at 2133Mhz.
it should in theory handle a new install of the OS at those clock rates.
I have done this with all of my systems when I clock them, to me it makes since to do it this way, because the with the OS system being installed at the higher clocks on the hardware, it truly understands the clock rates and will function more stable as a result.

my question is, if there is a better way, I would like to know of it?
thanks.
 
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