Thermal Compound: Best way of application

[beni_rohit]

im going to install an aftermarket heat sink on my CPU
just want to know what is the best method of applying thermal compound

after a little research i found:
1) Pea method- does not cover corners
2) Line method- does not cover corners
3) X method- covers corners effectively

whats your take on this?

 

[DelroyMonjo]

There is nothing in the corners that needs to be covered.

 

[Mr5oh]

Covering the corners doesn't necessarily matter. That being said, it depends on your CPU to which method is best.

Try this ArcticSilver Link

Personally I just use a credit card and spread it thinly across the entire surface. As thin as possible, but covering the entire chip. Has always worked for me better than anything else.

 

[beni_rohit]

if there is nothing in the corners to cover then i guess the pea method works the best
however ive heard the credit card spread method is not the best way
it leaves air bubbles which is likely to hamper cooling performance

 

[rmockett7]

if there is nothing in the corners to cover then i guess the pea method works the best
however ive heard the credit card spread method is not the best way
it leaves air bubbles which is likely to hamper cooling performance

all methods work the only difference is some may perform 1c cooler than the others so don't sweat just do it