So rice grain blob is usually recommended, even by Intel. Some say X or line for coverage, I'd say that would be too much paste forming that amount resulting being an insulator. However, too little, then the entire ihs isn't completely covered. For maximum heat transfer to heatsink, since complete metal to metal surface contact is preferred but obviously not possible even machine wise, there would assume be other areas between ihs and cooler not in rice grain's coverage that wouldn't be influencing efficient contact. Would having entire surface between ihs and heatsink be best spread thin or just a grain blob in middle really be enough?