It is a horrible idea though, because the one con outweighs the benefits of this product: Expensive though paste waste.
Thermal pads would be more cost effective and more efficient - except for high TDP cpus - and less wasteful!
...
Look how ridiculously THICK those applications are. We, as users, are just trying to fill in some pits that can't be seen with the naked eye.
Too. Much. Paste.
It should look more like
THIS after mounting a cooler.
That's great!
Thin layer, thick layer... margin of error difference... I do remember bits and pieces of the video you're referring to.
Now, where's the sample thermal difference for my argument of 'just enough to cover the die(s) beneath'? You're not going to leave that out, are you?