News TSMC struggles to meet demand for CoWoS packaging, holding back AI and HPC chip production: report

[Admin]

TSMC can barely meet demand for AI processors, as they need larger interposers.

TSMC struggles to meet demand for CoWoS packaging, holding back AI and HPC chip production: report : Read more

 

[Pierce2623]

Hasn’t that been the case ever since the H100 caught on really big?

 

[Mpablo87]

I thought about known last year events but right now this company is searching modern opportunities !